As far as smartphones are concerned, Samsung has been doing a pretty good job with its low budget as well as flagship models. However, the hitch regarding overheating problems has always remained an issue of major concern for all Samsung customers.
A few months ago when Qualcomm was about to unveil its new Snapdragon 820 chip set rumours went abuzz that the Soc chipset has similar overheating issues like its predecessor Snapdragon 810. Though Qualcomm was quick to refute these rumours, customers would like some reality backed proof to believe them.
Samsung in an effort to address this overheating issue is thinking about equipping the new Galaxy S7 with a heat pipe. The new Galaxy S7 is likely to be launched during the first half of 2016 and the company is said to experimenting with the size and shapes of different types of heat pipes. The final choice is expected to be made by the end of this year.
The Samsung S7 is expected to be released in two different chipset variations. The first one would be equipped with the company’s own Exynos 8890 chipset while the second one would have Qualcomm’s Snapdragon 820 processor. If bench mark scores are to be considered, then both the variants does not seem to have much difference in their performance capabilities.
According to Geekbench benchmark test, Samsung S7 with Exynos 8890 processor scored 2294 points on the single core performance test and 6908 points on the dual core performance test. The same model with a Snapdragon 820 processor scored 2456 points on the single core test and 5423 on the dual core test. The scores are much better than the processor speed of Apple 6S and Apple iPad Pro.
If Samsung manages to make a breakthrough in the heat pipe technology, it would be a benchmark in the field of mobile technology, which would provide the South Korean company a significant edge over its competitors.